Best shin etsu thermal paste

If you looking for shin etsu thermal paste then you are right place. We are searching for the best shin etsu thermal paste on the market and analyze these products to provide you the best choice.

Product	Features	Editor's score	Go to site
	MASSCOOL Shin-Etsu Thermal Interface Cooling Material G751		Go to amazon.com
	X23-7783D, Direct From Manufacturer, Shin-Etsu MicroSi Genuine High Performance Silicone Thermal Grease, Ten 0.5 gm syringes (10x0.5 gm), with Lot #, Exp. Date		Go to amazon.com
	Tiptiper 30g Thermal Grease Paste Silica Gel for CPU Chip Heatsink Conduction Insulation		Go to amazon.com
	X23-7783D, Direct From Manufacturer Shin-Etsu MicroSi, Genuine High Performance Silicone Thermal Grease, Five 0.5 gm syringes (5x0.5 gm), with Lot #, Exp. Date		Go to amazon.com
	4pcs Shin Etsu High Thermal Conductivity of Thermal Grease		Go to amazon.com
	Dynatron B12 Intel FCLGA3647 Socket 2U Passive CPU Cooler		Go to amazon.com

Related posts:

1. MASSCOOL Shin-Etsu Thermal Interface Cooling Material G751

Feature

MASSCOOL G751 Shin-Etsu Thermal Interface Material , Gray Paste.
Injection Tube Dimensions: 4.33" x 0.31" x 0.31" , Appearance: Gray Paste, Application: Injector with cap for easy application and storage. Electrically non-conductive.
Weight 0.5 Gram, Viscosity at 25 Degrees'(P) 3500 , Specific Gravity, at 25 Degrees' 2.5, Bleed after 24hrs. at 150 Degrees'(%) <0.1, Volatile Content: after 24hrs. at 150 Degrees'(%) <0.3,Thermal Conductivity (W/m K)>4.5.

Description

MASSCOOL G751 Shin-Etsu Thermal Interface Material

2. X23-7783D, Direct From Manufacturer, Shin-Etsu MicroSi Genuine High Performance Silicone Thermal Grease, Ten 0.5 gm syringes (10x0.5 gm), with Lot #, Exp. Date

Feature

Ten 0.5 gm syringe of X23-7783D (10x0.5gm)
Thermal Conductivity ~6.0 W/m K
Thermal Resistance ~7.3 mm2-K/W
BLT 72 um
Includes spreader

Description

Shin-Etsu MicroSi's X23- 7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23- 7783D to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi's X23-7783D is designed to meet current and future thermal management requirements, thus providing solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components. X23-7783D: Genuine Thermal Grease from Shin-Etsu Technical Data sheet: https://www.microsi.com/wp-content/uploads/2015/06/X23-7783D-TDS-June-2015.pdf

3. Tiptiper 30g Thermal Grease Paste Silica Gel for CPU Chip Heatsink Conduction Insulation

Feature

Condition:Brand new
Non-electrically conductive
99.9% pure micronized silver
Will not separate run migrate or bleed
Easy to apply and remove

Description

Color: Grey
Material: Silicone
Shape: Solid Paste

Features:

The product has high heat-conduction, high insulation, high temperature-resistent,
prolonged exposure will not be dry, not volatile, non-toxic, tasteless, non-corrosive.
Thermal conductivity:> 0.965
Thermal Impedance:> 0.225Operating
Temperature range: -30 to 180 C
Weight: 30g
Product Size: 10 * 1 cm

4. X23-7783D, Direct From Manufacturer Shin-Etsu MicroSi, Genuine High Performance Silicone Thermal Grease, Five 0.5 gm syringes (5x0.5 gm), with Lot #, Exp. Date

Feature

5 0.5gm syringe of X23-7783D (5x0.5 gm)
Thermal Conductivity ~6.0 W/m K
Thermal Resistance ~7.3 mm2-K/W
BLT 72 um
Includes spreader

Description

Shin-Etsu MicroSi's X23- 7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23- 7783D to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi's X23-7783D is designed to meet current and future thermal management requirements, thus providing solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components. X23-7783D: Genuine Thermal Grease from Shin-Etsu Technical Data sheet: https://www.microsi.com/wp-content/uploads/2015/06/X23-7783D-TDS-June-2015.pdf

5. 4pcs Shin Etsu High Thermal Conductivity of Thermal Grease

Description

Thermal Conductivity is 6.0W/mK. Weight: 2g Color: grey

6. Dynatron B12 Intel FCLGA3647 Socket 2U Passive CPU Cooler

Feature

Supports Intel Socket FCLGA 3647 Square ILM
Aluminum Stacked fin on Copper base with Heatpipes
Supports up to TDP 205 Watts
Recommended for 2U Server and up

Description

Dynatron B12 heatsink supports Intel Processors, Socket FCLGA 3647 Square ILM. Aluminum heatsink, copper base with heatpipes, pre-printed Shin Etsu 7762 thermal paste is passively cooled. Recommended for 1U servers and up with CPU TDP 205W.

Conclusion

By our suggestions above, we hope that you can found the best shin etsu thermal paste for you. Please don't forget to share your experience by comment in this post. Thank you!